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Gold Bonding Wire / Clad Bonding Wire |
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 Click to enlarge image
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Model Type
- Normal Type
- Low Loop Type
Specification
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type
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HAZ length(µm)
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Loop Height(µm)
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Loop Length(mil)
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Applicatory Packages
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AN Type
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230~280
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Min.200
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Max.150
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PLCC,PDIP,SOIC,SOP etc.
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AT Type
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110~150
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Min.90
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Max.200
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TSOP,TSSOP,TGFP,CCB etc.
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AW Type
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160~190
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Min.130
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Max.200
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BGA,SGFP,MGFP,SBGA etc.
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AF Type
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130~160
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Min.110
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Max.220
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Type
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HAZ LEngth(µm)
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Loop Height(µm)
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Loop Length(mil)
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Applicatory Packages
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CN Type
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230~280
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Min.200
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Max.150
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PLCC, PDIP, TO SOT,SOIC
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CT Type
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110~150
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Min.90
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Max.200
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SOIC, PDIP, TO, SOT
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CW Type
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160~190
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Min.130
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Max.200
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SOIC, MQFP, BGA
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CF Type
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130~160
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Min.110
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Max.220
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MQFP, BGA
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